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| Rev 2: Nov 2004 AO6409, AO6409L ( Green Product ) P-Channel Enhancement Mode Field Effect Transistor General Description The AO6409 uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate voltages as low as 1.8V. This device is suitable for use as a load switch or in PWM applications. It is ESD protected. AO6409L ( Green Product ) is offered in a lead-free package. Features VDS (V) = -20V ID = -5 A RDS(ON) < 45m (VGS = -4.5V) RDS(ON) < 56m (VGS = -2.5V) RDS(ON) < 75m (VGS = -1.8V) ESD Rating: 3000V HBM TSOP6 Top View D D G 16 25 34 D D S G D S Absolute Maximum Ratings TA=25C unless otherwise noted Parameter Symbol VDS Drain-Source Voltage VGS Gate-Source Voltage Continuous Drain Current A Pulsed Drain Current Power Dissipation A B Maximum -20 8 -5.0 -4.2 -30 2 1.28 -55 to 150 Units V V A TA=25C TA=70C TA=25C TA=70C ID IDM PD TJ, TSTG W C Junction and Storage Temperature Range Thermal Characteristics Parameter Maximum Junction-to-Ambient A Maximum Junction-to-Ambient A Maximum Junction-to-Lead C Symbol t 10s Steady-State Steady-State RJA RJL Typ 47.5 74 37 Max 62.5 110 50 Units C/W C/W C/W Alpha & Omega Semiconductor, Ltd. AO6409, AO6409L Electrical Characteristics (T J=25C unless otherwise noted) Symbol Parameter Conditions ID=-250A, VGS=0V VDS=-16V, VGS=0V TJ=55C VDS=0V, VGS=4.5V VDS=0V, VGS=8V VDS=VGS ID=-250A VGS=-4.5V, V DS=-5V VGS=-4.5V, I D=-5A RDS(ON) Static Drain-Source On-Resistance TJ=125C VGS=-2.5V, I D=-4A VGS=-1.8V, I D=-2A gFS VSD IS Forward Transconductance VDS=-5V, ID=-5A 8 Diode Forward Voltage IS=-1A,VGS=0V Maximum Body-Diode Continuous Current -0.3 -25 37 48 46 57 16 -0.78 -1 -2.2 1450 VGS=0V, VDS=-10V, f=1MHz VGS=0V, VDS=0V, f=1MHz 205 160 6.5 17.2 VGS=-4.5V, V DS=-10V, I D=-5A 1.3 4.5 9 VGS=-4.5V, V DS=-10V, RL=2.0, RGEN=3 IF=-5A, dI/dt=100A/s IF=-5A, dI/dt=100A/s 14 91 31 33 14 45 60 56 75 -0.55 Min -20 -1 -5 1 10 -1 A m m m S V A pF pF pF nC nC nC ns ns ns ns ns nC Typ Max Units V A A A STATIC PARAMETERS BVDSS Drain-Source Breakdown Voltage IDSS IGSS VGS(th) ID(ON) Zero Gate Voltage Drain Current Gate-Body leakage current Gate Threshold Voltage On state drain current DYNAMIC PARAMETERS Ciss Input Capacitance Coss Crss Rg Output Capacitance Reverse Transfer Capacitance Gate resistance SWITCHING PARAMETERS Qg Total Gate Charge Qgs Gate Source Charge Qgd tD(on) tr tD(off) tf trr Qrr Gate Drain Charge Turn-On DelayTime Turn-On Rise Time Turn-Off DelayTime Turn-Off Fall Time Body Diode Reverse Recovery Time Body Diode Reverse Recovery Charge A: The value of R JA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25C. The value in any a given application depends on the user's specific board design. The current rating is based on the t 10s thermal resistance rating. B: Repetitive rating, pulse width limited by junction temperature. C. The R JA is the sum of the thermal impedence from junction to lead RJL and lead to ambient. D. The static characteristics in Figures 1 to 6,12,14 are obtained using 80s pulses, duty cycle 0.5% max. E. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25C. The SOA curve provides a single pulse rating. THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN, FUNCTIONS AND RELIABILITY WITHOUT NOTICE. Alpha & Omega Semiconductor, Ltd. AO6409, AO6409L TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 25 -8V 20 15 10 VGS=-1.5V 5 0 0 1 2 3 4 5 -VDS (Volts) Fig 1: On-Region Characteristics 80 Normalized On-Resistance VGS=-1.8V RDS(ON) (m) 60 VGS=-2.5V 40 VGS=-4.5V 20 0 2 4 6 8 10 0.8 0 25 50 75 100 125 150 175 Temperature (C) Figure 4: On-Resistance vs. Junction Temperature -ID (A) Figure 3: On-Resistance vs. Drain Current and Gate Voltage 1.6 ID=-4A, VGS=-2.5V 1.4 ID=-3A, VGS=-1.8V 2 0 0 0.5 1 1.5 2 -VGS(Volts) Figure 2: Transfer Characteristics 25C 10 -4.5V -3.0V -2.0V -ID (A) -ID(A) -2.5V 6 4 125C 8 VDS=-5V 1.2 ID=-5A, VGS=-4.5V 1.0 100 90 80 RDS(ON) (m) 70 60 50 40 30 20 0 2 4 6 8 -VGS (Volts) Figure 5: On-Resistance vs. Gate-Source Voltage 25C 125C ID=-5A -IS (A) 1E+01 1E+00 1E-01 1E-02 1E-03 1E-04 1E-05 1E-06 0.0 0.2 0.4 0.6 0.8 1.0 1.2 -VSD (Volts) Figure 6: Body-Diode Characteristics 25C 125C Alpha & Omega Semiconductor, Ltd. AO6409, AO6409L TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 5 4 -VGS (Volts) 3 2 1 0 0 5 10 15 20 -Qg (nC) Figure 7: Gate-Charge Characteristics VDS=-10V ID=-5A Capacitance (pF) 2400 2000 1600 1200 800 Coss 400 Crss 0 0 5 10 15 20 -VDS (Volts) Figure 8: Capacitance Characteristics Ciss 100.0 TJ(Max)=150C TA=25C RDS(ON) limited 40 10s 30 100s 1ms Power (W) TJ(Max)=150C TA=25C -ID (Amps) 10.0 20 1.0 1s 10s DC 0.1 0.1 1 -VDS (Volts) 10 10ms 0.1s 10 100 0 0.001 0.01 0.1 1 10 100 1000 Figure 9: Maximum Forward Biased Safe Operating Area (Note E) Pulse Width (s) Figure 10: Single Pulse Power Rating Junction-toAmbient (Note E) 10 ZJA Normalized Transient Thermal Resistance D=Ton/T TJ,PK=TA+PDM.ZJA.RJA RJA=62.5C/W In descending order D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse 1 0.1 PD Ton Single Pulse T 0.01 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000 Pulse Width (s) Figure 11: Normalized Maximum Transient Thermal Impedance Alpha & Omega Semiconductor, Ltd. |
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